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| aic1190 ultra ldo 1a linear regulator with adjustable & bypass pin analog integrations corporation si-soft research center ds-1190g-06 20110106 3a1, no.1, li-hsin rd. i, science park, hsinchu 300, taiwan, r.o.c. tel: 886-3-5772500, fax: 886-3-5772510 www.analog.com.tw 1 ? features ? guaranteed 1a output current. ? fast response in line/load transient ? wide operating voltage ranges: 2.3v to 6.0v. ? 0.1a shutdown standby current ? low quiescent current: < 60a. ? fixed: 1.2v, 1.5v, 1.8v, 2.0v, 2.5v, 2.7v, 3.0v, 3.3v, 3.5v, 3.7v, 3.8v output voltage. ? output voltage are available from 0.8~5.0v in adjustable version. ? low dropout 440mv at 1a and 2.8v output voltage. ? high psrr 70db at 1khz. ? active low or high shutdown control. current limit and thermal protection. ? available in 2% output tolerance. ? available in sot-223 & to-220 (3 pin) & sop- 8 exposed pad (heat sink) and to-252 &to- 263 (3 & 5 pin) package. ? applications ? lcd tv, lcd monitor, dpf ? networking ? stb ? dvd, hdd driver ? portable av equipment ? pc peripherals ? description a low noise, high psrr and ultra low dropout linear regulator aic1190 is optimized for low esr ceramic capacitors operation with 1a continuous current. the aic1190 offers high precision output voltage of ? 2% tolerance. output voltage can also be adjusted for those other t han the preset values. a noise bypass pin is available for further reduction of output noise. the bypass pin could be floating if it?s unnecessa ry. at 1a load current and 2.8v output voltage, a 440mv dropout is performed. the quality of low quiescent current and low dropout voltage makes this device ideal for battery power applications. the high ripple rejection and low noise of the aic1190 provide enhanced performances for critical applications such as cellular phones, and pdas. in addition, a logic-level shutdown input is included, which reduce supply current to less than 0.1a (typ.) in shutdown mode with fast turn-on time less than 100s. the aic1190?s current limit and thermal protection provide protection against any overload condition that would create excessive junction temperatures. ? typical application circuit fixed linear regulator adjustable linear regulator
aic1190 2 ? typical application circuit (continued) adjustable linear regulator in sop-8 exposed pad package ? ordering information pac king typ e tr: tape & reel tb: tube package type y3: sot-22 3 e3: to-252 m3: to-263 t3: to-220 p: lead free commercial g: green package output voltage 08: 0.8v 10: 1.0v 12: 1.2v 15: 1.5v 18: 1.8v 20: 2.0v 25: 2.5v 27: 2.7v 30: 3.0v 33: 3.3v 35: 3.5v 37: 3.7v 38: 3.8v (of a unit of 0.1v w ithin 0.8~4.5v, additional voltage versions are available on demand) 3 pin configuration to-263 (m3) top view 1: vin 2: gn d (tab) 3: vout to-252 (e3) top view 1: vin 2: gnd (tab) 3: vout a ic1190-xxxxx xx example: aic1190-18pe3tr ? 1.8v version, in to-252 lead free pa ckage & tape & r eel pa ckin g type sot-223 (y3) top vi ew 1: vin 2: gnd (tab) 3: vout to-220 (t3) top view 1: vin 2: gnd (tab) 3: vout 2 3 1 2 3 1 1 2 3 2 3 1 aic1190 3 ? ordering information (continued) pa c ki n g t y pe tr: tape & reel tb: tube package type e4: to-252-4 e5: to-252-5 m5: to-263-5 p: lead free commercial g: green package outp ut voltage 08: 0.8v 10: 1.0v 12: 1.2v 15: 1.5v 18: 1.8v 20: 2.0v 25: 2.5v 27: 2.7v 30: 3.0v 33: 3.3v 35: 3.5v 37: 3.7v 38: 3.8v (of a unit of 0.1v within 0.8~4.5v, additional voltage versions are available on demand) enable type l: chip enable low h: chip enable high b: byp ass a : adj 5 pin configuration a ic1190xx-xxxxx xx example: aic1190bh-18pm5tr ? with bypass pin, chip enable h igh, 1.8v version, in to-263-5 lead free package & tape & reel packing type output voltage could be adjusted from 0.8v to 5.0v by external resistors. to-252-5 (e5) top view 1: en / en 2: vin 3: gnd (tab) 4: vou t 5: bp/ ad j 1 2 3 4 5 to-263-5 (m5) top view 1: en / en 2: vin 3: gnd (tab) 4: vou t 5: bp/ ad j 12 4 5 3 to-252-4 (e4) to p vie w 1: en / en 2: vin 3: gnd (tab) 4: vou t 5: bp/ adj 1 2 3 4 5 aic1190 4 ? ordering information (continued) pac king typ e tr: tape & reel tb: tube package type r8: sop-8 g: green package output voltage 08: 0.8v 10: 1.0v 12: 1.2v 15: 1.5v 18: 1.8v 20: 2.0v 25: 2.5v 27: 2.7v 30: 3.0v 33: 3.3v 35: 3.5v 37: 3.7v 38: 3.8v (of a unit of 0.1v w ithin 0.8~4.5v, additional voltage versions are available on demand) enable type l: chip enable low h: chip enable high 8 pin configuration a ic1190x-xxxxx xx example: aic1190h-18gr8tr ? chip enable high, 1.8v version, in sop-8 green package & tape & reel packing type output voltage could be adjusted from 0.8v to 5.0v by external resistors. sop-8 (r8) exposed pad (heat sink) top view 1: en / en 2: vin 3: vout 4: adj 5: gnd (tab) 6: bp 7: gnd (tab) 8: gnd (tab) 8 6 5 7 1 3 2 4 ? marking part no marking part no marking AIC1190-XXPY3 hbxxp aic1190-xxgy3 hbxxg xx represents output voltage. (08=0.8v, 09=0.9v, ?.?, 44=4.4v, 45=4.5v) aic1190 5 ? absolute maximum ratings input vo ltage ....................................................................................................................................... 7v en pin voltage................................................................................................................. ................... 7v noise bypass te rminal voltage.................................................................................................. ........ 7v operating temperat ure range ............................................................................................ -40oc~85 oc maximum junction temperature .................................................................................................. 1 50oc storage temperature range ............................................................................................. - 65oc~150 oc lead temperature (sol dering, 10 sec) ......................................................................................... 26 0oc thermal resistance (junction to case) sot- 223 ............................................................... 15oc /w to-252.................................................................... 8oc /w to-263.................................................................... 3oc /w to-220.................................................................... 3oc /w sop-8 (exposed pad*)...................................... ... 15oc /w thermal resistance (junction to ambient) sot- 223 ............................................................. 130o c /w (assume no ambient airflow, no heat sink) to -252................................................................ 100o c /w to-263.................................................................. 60oc /w to-220.................................................................. 50oc /w (assume no ambient airflow) sop-8 (exposed pad* ) ......................................... 60oc /w absolute maximum ratings are those values beyond which the life of a device may be impaired. * the package is placed on a two layers pcb with 2 ounces copper and 2 square inch, connected by 8 vias. aic1190 6 ? electrical characteristics (c in = c out = 2.2 ? f, c bp = 22nf, v in = v out + 1v, t j =25? c, unless otherwise specified) (note 1) parameter test conditions symbol min. typ. max. unit input voltage v in 2.3 6.0 v output voltage tolerance i out = 1 ma v out -2 2 % continuous output current i out 1.0 a quiescent current chip enable low, v en Q 0.4v, i out = 0 ma chip enable high, v en R 1.6v, i out = 0 ma i q 60 110 ? a gnd pin current chip enable low, v en Q 0.4v, i out = 1a chip enable high, v en R 1.6v, i out = 1a i gnd 60 110 ? a standby current chip enable low, v en = v in chip enable high, v en = 0 i stby 0.1 0.5 ? a output current limit r load = 0.1 i il 1.1 1.6 2.2 a i out = 1a, 0.8v aic1190 7 ? electrical characteristics (continued) parameter test conditions symbol min. typ. max. unit shutdown pin specifications shutdown pin current v en = v in or gnd i en 0 100 na shutdown exit delay time i out = 30ma ? t 100 ? s max output discharge resistance to gnd during shutdown rdson_ clmp 20 100 chip enable low, output off, v in = 2.3v to 6.0v chip enable high, output on, v in = 2.3v to 6.0v v enh 1.6 shutdown input threshold chip enable low, output on, v in = 2.3v to 6.0v chip enable high, output off, v in = 2.3v to 6.0v v enl 0.4 v note 1: specifications are production tested at t a =25c. specifications over the -40c to 85c operating temperature range are assu red by design, characterization and co rrelation with statistical quality controls (sqc). note 2: connecting a 22nf bypass capacitor to bp pin can improve aic1190 psrr in high frequency. aic1190 8 ? typical performance characteristics 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 50 52 54 56 58 60 62 64 v out =3.3v v out =2.0v supply current (ua) input voltage (v) 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 1.9850 1.9875 1.9900 1.9925 1.9950 1.9975 2.0000 v in =v out +1 v out =2.0v i out =1ma i out =10ma i out =90ma output voltage (v) input voltage (v) fig. 1 supply current vs. input voltage fig. 2 output voltage vs. input voltage 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 55 56 57 58 59 60 61 62 63 64 65 i load =100ma i load =500ma v in =v out +1 v out =2.0v ground current (ua) supply voltage (v) -40 -20 0 20 40 60 80 100 120 140 46 48 50 52 54 56 58 60 62 64 v in =v out +1 v out =2.0v quiescent current (ua) temperature fig. 3 ground current fig. 4 quiescent current vs. temperature -40 -20 0 20 40 60 80 100 120 140 -0.6 -0.4 -0.2 0.0 0.2 0.4 v in =v out +1 v out =2.0v output voltage variation (%) temperature fig. 5 output voltage vs. temperature fig.6 start-up waveform without bypass capacitance () () input current input voltage output voltage aic1190 9 ? typical performanc e characteristics (continued) fig.7 shutdown transient fig. 8 start-up waveform without bypass capacitor fig. 9 line transient fig.10 load trans ient response at v in =4.3v, v out =3.3v fig.11 load transient response at v in =2.3v, v out =0.8v fig.12 load transient response at v in =3.0v, v out =2.0v c in =c out =2.2 ? f c in =c out =2.2 ? f c in =c out =2.2 ? f v in =4.5v, v out =3.3v and i out = 10ma v in =4.5v, v out =3.3v and i out = 10ma v in =2.3~3.3v, v out =0.8v, i out =1000ma input volta g e output ripple out p ut current output voltage out p ut volta g e en en out p ut volta g e ri pp le output current out p ut volta g e ri pp le output current i out = 1ma to 1a c in =c out =2.2 ? f i out = 1ma to 1a c in =c out =2.2 ? f c in =c out =2.2 ? f out p ut volta g e ri pp le output current i out = 1ma to 1a aic1190 10 ? typical performanc e characteristics (continued) 0 200 400 600 800 1000 0 100 200 300 400 500 t=-40 t=25 t=85 dropout voltage (mv) output current (ma) v out = 2.8v 600 700 800 900 1000 400 450 500 550 600 650 700 minimum operation voltage= 1.8v+0.5v t=85 t=25 t=-40 dropout voltage (mv) output current (ma) v out = 1.8v fig. 13 dropout voltage vs. output current fig. 14 dropout voltage vs. output current 0.00.20.40.60.81.01.21.41.61. 8 0.0 0.2 0.4 0.6 0.8 1.0 feedback voltage (v) foldback current (a) fig. 15 current fold back (vout<0.2v) fig. 16 psrr curve aic1190 11 ? block diagram ? pin description vin ? power supply input pin. bypass with a 2.2f capacitor to gnd gnd ? ground. vout ? regulator output pin. sources up to 1a. en (5 pin and 8 pin) ? chip enable (active low). this pin isn?t allowed to float. en (5 pin and 8 pin) ? chip enable (active high). this pin isn?t allowed to float. bp (5 pin and 8 pin) ? bypass pin. it can connect to ex ternal 22nf capacitor to gnd to reduce output noise. the bypass pin could be floating if it?s unne cessary (keep floating cannot pull low and pull high). adj (5 pin and 8 pin) ? the output voltage can either be set by the internal feedback resistors when this pin is grounded, or be set by the external feedbac k resistors when using a resistive divider. aic1190 12 ? application information the aic1190 is a high performance linear regulator that provides low-dropout voltage and low quiescent- current. the device is available in an adjustable version and fixed output voltages ranging from 1.2v to 3.8v, and the device can supply loads up to 1a. shutdown by connecting en(en) pin to v in (ground), the aic1190 can be shut down to reduce the supply current to 0.1 ? a(typ.). at this operation mode, the output voltage of aic1190 is equal to 0v. current limit the aic1190 includes a current limiter, which monitors and controls the maximum out put current. if the output is overloaded or shorted to ground, this can protect the device from being damaged. thermal protection the aic1190 includes a thermal-limiting circuit, which is designed to protect the device against overload condition. when the junction temperature exceeds t j =150oc, the thermal-limiting circuit turns off the pass transistor and allows the ic to cool. for continuous load condition, maximum rating of junction temperature must not be exceeded. input-output capacitors linear regulators require input and output capacitors to maintain stability. input capacitor at 2.2 ? f with a 2.2? f ceramic output capacitor is recommended. when choosing the input and output ceramic capacitors, x5r and x7r types are recommended because they retain their capacitance over wider ranges of voltage and temperature than other types. noise bypass capacitor a 22nf bypass capacitor at bp pin can reduce output voltage noise. the bypass pin can be floating if it?s unnecessary. output voltage programming the output voltage of aic 1190 linear regulator can be set by its internal feedback resistors when the adj pin is grounded. in addition, t he output voltage of aic1190 linear regulator can be set by the external feedback resistors when connecting a resistive divider r 1 and r 2 . while connecting a resistive divider, v out can be calculated as: ? ? ? ? ? ? ? ? ??? 2 1 out r r 18.0v the resistive divider should sit as close to adj pin as possible. power dissipation the maximum power dissipation of aic1190 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. the rate of temperature rise is greatly affected by the mounting pad configuration on the pcb, the board material, and the ambient temperature. when the ic mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. the power dissipation across the device is p = i out (v in -v out ) the maximum power dissipation is: ja a max-j max r )t-(t p ? where t j-max is the maximum allowable junction temperature (150 ? c), and t a is the ambient temperature suitable in application. as a general rule, the lower temperature is, the better reliability of the device is. so the pcb mounting pad should provide maximum thermal conductivity to maintain low device temperature. aic1190 13 ? physical dimensions ? sot-223 package outline drawing 3.30 0 1.55 0.90 6.70 6.30 0.23 2.90 0.66 0.02 e1 l e1 e b2 d e c b a2 a1 3.70 8 2.30 bsc 4.60 bsc 1.65 7.30 6.70 0.33 3.10 0.84 0.10 min. s y m b o l a 1.80 max. sot-223 millimeters note: 1. refer to jedec to-261aa. 2. dimension "d" does no t include mold flash, protrus ions or gate burrs. mold flash, protrusion or gate bur rs shall not exceed 6 mil per side . 3. dimension "e1" does n ot include inter-lead flash o r protrusions. 4. controlling dimensio n is millimeter, converted inc h dimensions are n ot necessarily exact. c b a a2 with plating view b 0.25 l seating plane gauge plane a1 base metal section a-a d e e1 e aa b2 e1 see view b aic1190 14 ? to-252-3l package outline drawing c2 see view b a h b3 a a e e d l3 l4 c base metal with plating seating plane b section a-a view b a1 l l1 gauge plane l2 ? thermal pad d1 e1 millimeters to-252-3l max. 2.38 a s y m b o l min. 2.19 0.13 5.46 0.61 0.89 6.22 6.73 0.89 2.67 ref 0.51 bsc 10.41 1.78 2.03 1.02 2.28 bsc a1 b b3 c2 e d c h l l1 l2 l4 l3 e 0.00 4.95 0.46 0.46 5.33 6.35 9.40 1.40 0.89 -- 0.64 0 8 ? 6.00 4.60 5.46 3.90 d1 e1 note: 1. refer to jedec to-252aa and ab. 2. dimension "e" does no t include mold flash, protrus ions or gate burrs. mold flash, protrus ion or gate bur rs shall not exceed 6 mil per side . 3. dimension " d" does not include inter-lead flash or protrusions. 4. contr olling dimension is mi llimeter, converted inc h dimensions are n ot necessarily exact. aic1190 15 ? to-252-4l package outline drawing l2 with plating base metal c l3 d e e a a b3 h a see view b c2 ? gauge plane l1 l a1 view b section a-a b seating plane thermal pad d1 e1 l4 note: 1. refer to jedec to-252ad and ab. 2. dimension "e" does not include mold flash, protrus ions or gate burrs. mold flash, protrusion or gate bur rs shall not exceed 6 mil per side . 3. dimension "d" does not include inter-lead flash or protrusions. 4. controlling dimension is millimeter, converted inc h dimensions are not necessarily exact. 0 0.51 0.89 1.40 9.40 6.35 5.33 0.46 0.46 4.32 0.00 e l3 l2 l1 l h c d e c2 b3 b a1 1.27 bsc 8 2.03 1.78 10.41 0.51 bsc 2.67 ref 0.71 6.73 6.22 0.89 0.61 5.46 0.13 2.19 min. s y m b o l a2 . 3 8 max. to-252-4l millimeters 4.90 d1 6.00 4.32 e1 5.33 0.6 l4 1.0 aic1190 16 ? to-252-5l package outline drawing ? l2 gauge plane l1 l a1 view b section a-a b seating plane with plating base metal c l3 d e e a a b3 h a see view b c2 thermal pad d1 e1 note: 1. refer to jedec to-252ad and ab. 2. dimensi on "e" does not include mold flash, protrus ions or gate burrs. mold flash, protrusion or gate bur rs shall not exceed 6 mil per side . 3. dimension "d" does not include inter-lead flash or protrusions. 4. controlling dimensi on is millimeter, converted inc h dimensions are not necessarily exact. 0 0.51 0.89 1.40 9.40 6.35 5.33 0.46 0.46 4.32 0.00 e l3 l2 l1 l h c d e c2 b3 b a1 1.27 bsc 8 2.03 1.78 10.41 0.51 bsc 2.67 ref 0.71 6.73 6.22 0.89 0.61 5.46 0.13 2.19 min. s y m b o l a2 . 3 8 max. to-252-5l millimeters 4.90 d1 6.00 4.32 e1 5.33 aic1190 17 ? to-263-3l package outline drawing e1 d1 section a-a b see view b c l2 e a a h d l1 a c2 b2 e l view b ? l3 gauge plane a1 seating plane with plating base metal thermal pad note: 1. refer to jedec to-263ab. 2. dimension "e" does not include mold flash, protrus ions or gate burrs. mold flash, protrusion or gate bur rs shall not exc eed 6 mil per side . 3. dim ension "d" does not include inter-lead flash or protrusions. 4. controlling dimensi on is millimeter, converted inc h dimensions are not necessarily exact. 0 0.51 -- 1.78 14.61 9.65 8.38 1.14 0.38 1.14 0.00 e l3 l2 l1 l h c d e c2 b2 b a1 2.54 bsc 8 1.68 1.78 2.79 15.88 0.25 bsc 0.99 10.67 9.65 1.65 0.74 1.78 0.25 4.06 min. s y m b o l a4 . 8 3 max. to-263-3l millimeters -- 6.86 d1 6.23 e1 -- -- aic1190 18 ? to-263-5l packa ge outline drawing e l view b ? l3 gauge plane a1 seating plane with plating base metal e1 d1 thermal pad section a-a b see view b c e a a h d l1 a c2 note: 1. refer to jedec to-263ba. 2. dimension "e" does not include mold flash, protrus ions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. dimension "d" does not include inter-lead flash or protrusions. 4. controlli ng dimension is millimeter, converted inc h dimensions are not necessarily exact. 8.38 0 0.51 1.78 14.61 9.65 1.14 0.38 0.00 h l3 l1 l c2 e e d c b a1 15.88 8 1.68 2.79 0.25 bsc 0.99 10.67 9.65 1.65 0.74 0.25 1.70 bsc 4.06 min. s y m b o l a 4.83 max. to-263-5l millimeters -- 6.86 d1 -- 6.23 e1 -- aic1190 19 ? to-220 package outline drawing 2.54 5.85 1.15 3.54 12.70 2.04 0.51 2.54 bsc 9.66 14.23 0.35 0.38 h1 q p l1 l a2 d e a1 e c b2 b 6.85 3.42 6.35 4.08 14.73 2.92 1.77 1.39 10.66 16.51 0.61 1.01 3.56 min. s y m b o l a 4.82 max. to-220 millimeters d1 8.38 9.02 -- note: 1. refer to jedec to-220ab. 2. dimension "e" does not include mold flash, protrus ions or gate burrs. mold flash, protrusion or gate bur rs shall not exceed 6 mil per side . 3. dimension "d1" does not include inter-lead flash o r protrusions. 4. controlling dimension is millimeter, converted inc h dimensions are not necessarily exact. section a-a b a2 l l1 b2 e aa e p q d h1 a with plating base metal a1 c d1 aic1190 20 ? sop-8 exposed pad package outline drawing note: information provided by aic is believed to be accurate and relia ble. however, we cannot assume responsibility for use of any ci rcuitry other than circuitry entirely embodied in an aic product; nor fo r any infringement of patents or other rights of third parties that may result from its use. we reserve the right to change t he circuitry and specifications without notice. life support policy: aic does not authorize any aic product for us e in life support devices and/or systems. life support device s or systems are devices or systems which, (i) are intended for surgic al implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, c an be reasonably expected to res ult in a significant injury to the user. note : 1. refer to jedec ms-012e. 2. dimension "d" does not include mold flash, protru sions or gate burrs. mold flash, protrusion or gate bu rrs shall not exceed 6 mil per side . 3. dimension "e" does no t include inter-lead flash o r protrusions. 4. controlling dimension is millimeter, converted in ch dimensions are not necessarily exact. a d ? l view b 0.25 seating plane section a-a base metal gauge plane with plating a1 b c e aa h e d1 e1 exposed thermal pad(heat sink) (bottom center of package) h x 45 see view b h l d e h e c b a1 0 8 1.27 bsc 4.80 3.80 0.31 0.17 0.00 5.00 4.00 0.51 0.25 0.15 s y m b o l a sop-8 exposed pad(heat sink) millimeters 1.35 min. 1.75 max. d1 e1 3.50 1.50 1.0 2.55 5.80 6.20 0.25 0.50 0.40 1.27 |
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